this is information on a product in full production. october 2014 docid027021 rev1 1/10 10 stps4s200 power schottky rectifier datasheet ? production data features ? negligible switching losses ? high junction temperature capability ? very small conduction losses ? low leakage current ? avalanche rated ? ecopack ? compliant component (smbflat) ? t j = -40 c minimum operating description this device is a 200 v schottky rectifier suited for switch mode power supplies and high frequency dc to dc converters. packaged in dpak and smbflat, this device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. also ideal for all led lighting applications. 6 0 % i o d w . $ $ ' 3 $ . . 1 & . . $ table 1. device summary symbol value i f(av) 4 a v rrm 200 v v f (typ) 0.64 v t j (max) 175 c www.st.com
characteristics stps4s200 2/10 docid027021 rev1 1 characteristics when the two diodes 1 and 2 are used simultaneously: t j (diode1) = p(diode1) x r th(j-c) (per diode) + p(diode2) x r th(c) to evaluate the conduction losses use the following equation: p = 0.63 x i f(av) + 0.020 i f 2 (rms) table 2. absolute ratings (limiting values at 25 c, unless otherwise specified) symbol parameter value unit v rrm repetitive peak reverse voltage 200 v i f(rms) forward rms current 10 a i f(av) average forward current, = 0.5, square wave dpak, t c = 160 c 4a smbflat, t l = 125 c i fsm surge non repetitive forward current t p = 10 ms sinusoidal 250 a t stg storage temperature range -65 to +175 c t j operating junction temperature (1) -40 to +175 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj --------------- 1 rth j a ? () ------------------------- - < table 3. thermal parameters symbol parameter value unit r th(j-c) junction to case, dpak 3.2 c/w r th(j-l) junction to lead, smbflat 15 table 4. static electrical characteristics symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 5a t j = 125 c 0.7 2.5 ma v f (2) forward voltage drop t j = 25 c i f = 4 a 0.87 v t j = 125 c 0.64 0.71 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
docid027021 rev1 3/10 stps4s200 characteristics figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) / / / / / 3 ) $ 9 : , ) $ 9 $ 7 / w s 7 w s 7 d p e ? & ' 3 $ . 5 w k m d 5 w k m f , ) $ 9 $ 7 / w s 7 w s 6 0 % i o d w 5 w k m d 5 w k m o figure 3. relative variation of thermal impedance, junction to case, versus pulse duration (dpak) figure 4. relative variation of thermal impedance, junction to lead versus pulse duration (smbflat) ( ( ( ( ( = w k m f 5 w k m f ( w 3 v ' 3 $ . 6 l q j o h s x o v h ( ( ( ( ( ( = w k m o 5 w k m o w 3 v 6 0 % i o d w 6 l q j o h s x o v h figure 5. reverse leakage current versus reverse voltage applied (typical values) figure 6. junction capacitance versus reverse voltage applied (typical values) , 5 ? $ ( ( ( ( ( ( ( 7 m ? & 7 m ? & 7 m ? & 7 m ? & 7 m ? & 7 m ? & 9 5 9 & s ) 9 5 9 ) 0 + ] 9 2 6 & p 9 5 0 6 7 m ? &
characteristics stps4s200 4/10 docid027021 rev1 figure 7. forward voltage drop versus forward current (typical values) figure 8. forward voltage drop versus forward current (maximum values) , ) $ 7 m ? & 9 ) 9 7 m ? & , ) $ 7 m ? & 9 ) 9 7 m ? & figure 9. thermal resistance junction to ambient versus copper surface under tab (typical values) figure 10. thermal resistance junction to ambient versus copper surface under each lead (typical values) 5 w k m d ? & : 6 & 8 f p e ' 3 $ . ( s r [ \ s u l q w h g e r d u g ) 5 h & 8 ? p 5 w k m d ? & : 6 & 8 f p e 6 0 % i o d w ( s r [ \ s u l q w h g e r d u g ) 5 h & 8 ? p
docid027021 rev1 5/10 stps4s200 package information 2 package information ? epoxy meets ul94,v0 ? lead-free package ? band indicates cathode in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 11. dpak dimension definitions + / * % / ( % ' $ 5 5 & $ & p l q 9 $
package information stps4s200 6/10 docid027021 rev1 figure 12. footprint (dimensions in mm) table 5. dpak dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 2.20 2.40 0.086 0.094 a1 0.90 1.10 0.035 0.043 a2 0.03 0.23 0.001 0.009 b 0.64 0.90 0.025 0.035 b2 5.20 5.40 0.204 0.212 c 0.45 0.60 0.017 0.023 c2 0.48 0.60 0.018 0.023 d 6.00 6.20 0.236 0.244 e 6.40 6.60 0.251 0.259 g 4.40 4.60 0.173 0.181 h 9.35 10.10 0.368 0.397 l2 0.80 typ. 0.031 typ. l4 0.60 1.00 0.023 0.039 v2 0 8 0 8
docid027021 rev1 7/10 stps4s200 package information figure 13. smbflat dimensions definitions table 6. smbflat dimension values ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.155 e 5.10 5.60 0.200 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.029 0.059 l1 0.40 0.016 l2 0.60 0.024 ' $ / [ / / [ / [ ( ( e f
package information stps4s200 8/10 docid027021 rev1 figure 14. smbflat footprint, dimensions in mm (inches)
docid027021 rev1 9/10 stps4s200 ordering information 3 ordering information 4 revision history table 7. ordering information order code marking package weight base qty delivery mode stps4s200b-tr s4 200b dpak 0.3 g 2500 tape and reel STPS4S200UF fg42 smbflat 0.050 g 5000 tape and reel table 8. document revision history date revision changes 17-oct-2014 1 first release.
stps4s200 10/10 docid027021 rev1 important notice ? please read carefully stmicroelectronics nv and its subsidiaries (?st?) reserve the right to make changes, corrections, enhancements, modifications, and improvements to st products and/or to this document at any time without notice. purchasers should obtain the latest relevant in formation on st products before placing orders. st products are sold pursuant to st?s terms and conditions of sale in place at the time of o rder acknowledgement. purchasers are solely responsible for the choice, selection, and use of st products and st assumes no liability for application assistance or the design of purchasers? products. no license, express or implied, to any intellectual property right is granted by st herein. resale of st products with provisions different from the information set forth herein shall void any warranty granted by st for such product. st and the st logo are trademarks of st. all other product or service names are the property of their respective owners. information in this document supersedes and replaces information previously supplied in any prior versions of this document. ? 2014 stmicroelectronics ? all rights reserved
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